Izici:
1. Isithwali sefilimu se-polyimide esivumelana nezimo
2. I-adhesive ye-silicone ye-organic side ephindwe kabili
3. Kulula ukucwecwa ngaphandle kokushiya izinsalela
4. Ukumelana nokushisa okuphezulu
5. Ukumelana okuhle kwe-shear kanye nokumelana ne-solvent yamakhemikhali.
6. Ukwazi ukufa usikwe kunoma iyiphi isayizi nokuma
Izicelo:
Itheyiphu ye-polyimide eseceleni ekabili inendawo yokumelana nokushisa okuphezulu engase isetshenziselwe ukuvala izinga lokushisa eliphezulu ukuze kuvikelwe ibhodi le-PCB phakathi ne-wave solder noma i-reflow soldering noma isetshenziswe njengezinto zokuvala ugesi zokucutshungulwa kwe-capacitor ne-transformer.
Ngezansi kukhona imboni ejwayelekile ye-polyimide tape:
Imboni ye-Aerospace
PCB Board yokukhiqiza
I-Capacitor kanye ne-transformer insulation
Ukumboza ngempushana---njengokufihla izinga lokushisa eliphezulu
Imboni yezimoto