• Email: fanny.gbs@gbstape.com
  • I-Copper Clad Polyimide Film Single Side FCCL Sheet for FPC Board Assembly

    Incazelo emfushane:

     

    Ifilimu ye-Copper Clad Polyimideisebenzisa ifilimu ye-amber noma ye-polyimide emnyama njengefilimu eyisisekelo futhi ihlanganiswe nge-copper foil tape.Ivamise ukusetshenziswa kanye nefilimu embozekile ye-thermosetting embonini yamabhodi e-Flexible Printed Circuits, ehlanganisa ukumelana nezinga lokushisa eliphezulu okuhle kakhulu nokusebenza kokushisa.Izinga lokushisa lokumelana ne-soldering lingu-288 ℃ ngaphandle kwamabhamuza kanye ne-delamination.Sinemikhiqizo yochungechunge oluphelele lwe-PI base FCCL kanye ne-polyimide thermosetting coverlay kanye neshidi le-polyimide stiffener, elingahlinzeka ngezixazululo ezichwepheshile zokuhlanganisa Ibhodi le-FPC noma enye imboni yokumelana nokushisa kanye nemboni yokukhiqiza ukufakwa kwezinto zikagesi.


    Imininingwane Yomkhiqizo

    Omaka bomkhiqizo

    Izici:

    1. Ukumelana kahle kwe-shear

    2. Izinga lokushisa lokumelana ne-soldering ngu-288℃

    3. Ukuzinza kwamakhemikhali okuhle kakhulu,

    4. Ukumelana nemisebe,

    5. Ukumelana ne-Chemical solvent kanye ne-anti-corrosion

    6. Kulula ukufa-ukusika kunoma yimuphi umklamo womumo wangokwezifiso

    7. Ukufakwa kukagesi okusezingeni eliphezulu

    8. Ingcina ye-thermosetting

    9. Isiphetho esibushelelezi, awekho amabhamuza kanye ne-delamination

    ifilimu ye-polyimide

    Ibhodi lesifunda le-FPC eliguquguqukayo livamise ukuboshelwa nge-adhesive thermosettingifilimufuthii-polyimide stiffeneripuleti.I-adhesive thermosettingifilimuis ngaphandle viscosity ngenkathiokuqinile ekushiseni okuvamile, kodwa lapho izinga lokushisa likhuphuka liye kwelinyeububanzi, izoshintsha ibe yisimo esiqinile esine-viscosity eqinile.Ngalesi sikhathi, i-FPC izonamathela ku-i-polyimide stiffeneripuleti.Umkhuba ojwayelekile uwukuhlanganisa iI-PI stiffener fanele kwesokudlaisikhundla, futhi usebenzise ugesii-solderingiron for 1 ~ 2 imizuzwana ukuzelungisa iiphuzu elilodwa isikhundlan.Ngemuva kokushisa okuphezulu nokucindezela okuphezuluing, yonke indawokungabaukuhlangana ngokuphelele,beseukubhakaifilimu ukwelapha ingcina.

    Isimo sokucutshungulwa kwefilimu ye-copper clad polyimide noma ishidi le-polyimide stiffener:

    1. Ibhendi yokuqala: izinga lokushisa ngu-120℃, ukucindezela okuphezulu okungu-20kg/ cm², 1min;

    2. Ibhendi yesibili: izinga lokushisa 140℃, ukucindezela okuphezulu 30kg/ cm², 80min;

    3. Ibhendi yesithathu: izinga lokushisa 80℃,ingcindezi ephezulu 30kg/cm², 5min;

     

    Isicelo:

    Ukuhlanganiswa kwebhodi le-FPC

    PCB Board yokukhiqiza

    I-Coverlay noma i-Stiffener ku-F-PCB.

    Umhlangano webhodi lesifunda sezimoto

    Transformer kanye Motor Insulation.


  • Okwedlule:
  • Olandelayo: