Izici:
1. Ukumelana kahle kwe-shear
2. Izinga lokushisa lokumelana ne-soldering ngu-288℃
3. Ukuzinza kwamakhemikhali okuhle kakhulu,
4. Ukumelana nemisebe,
5. Ukumelana ne-Chemical solvent kanye ne-anti-corrosion
6. Kulula ukufa-ukusika kunoma yimuphi umklamo womumo wangokwezifiso
7. Ukufakwa kukagesi okusezingeni eliphezulu
8. Ingcina ye-thermosetting
9. Isiphetho esibushelelezi, awekho amabhamuza kanye ne-delamination
Ibhodi lesifunda le-FPC eliguquguqukayo livamise ukuboshelwa nge-adhesive thermosettingifilimufuthii-polyimide stiffeneripuleti.I-adhesive thermosettingifilimuis ngaphandle viscosity ngenkathiokuqinile ekushiseni okuvamile, kodwa lapho izinga lokushisa likhuphuka liye kwelinyeububanzi, izoshintsha ibe yisimo esiqinile esine-viscosity eqinile.Ngalesi sikhathi, i-FPC izonamathela ku-i-polyimide stiffeneripuleti.Umkhuba ojwayelekile uwukuhlanganisa iI-PI stiffener fanele kwesokudlaisikhundla, futhi usebenzise ugesii-solderingiron for 1 ~ 2 imizuzwana ukuzelungisa iiphuzu elilodwa isikhundlan.Ngemuva kokushisa okuphezulu nokucindezela okuphezuluing, yonke indawokungabaukuhlangana ngokuphelele,beseukubhakaifilimu ukwelapha ingcina.
Isimo sokucutshungulwa kwefilimu ye-copper clad polyimide noma ishidi le-polyimide stiffener:
1. Ibhendi yokuqala: izinga lokushisa ngu-120℃, ukucindezela okuphezulu okungu-20kg/ cm², 1min;
2. Ibhendi yesibili: izinga lokushisa 140℃, ukucindezela okuphezulu 30kg/ cm², 80min;
3. Ibhendi yesithathu: izinga lokushisa 80℃,ingcindezi ephezulu 30kg/cm², 5min;
Isicelo:
Ukuhlanganiswa kwebhodi le-FPC
PCB Board yokukhiqiza
I-Coverlay noma i-Stiffener ku-F-PCB.
Umhlangano webhodi lesifunda sezimoto
Transformer kanye Motor Insulation.
