Iimbonakalo:
1. Ukumelana kakuhle nokucheba
2. Ubushushu bokumelana ne-Soldering yi-288℃
3. Uzinzo olugqwesileyo lweekhemikhali,
4. Ukumelana nemitha,
5. Ukumelana ne-Chemical solvent kunye ne-anti-corrosion
6. Kulula ukufa-ukunqunyulwa kulo naluphi na uyilo lwemilo yesiko
7. Ukufakwa kombane okumgangatho ophezulu
8. I-adhesive ye-thermosetting
9. Ukugqiba okugudileyo, akukho amaqamza kunye nokuncipha
Ibhodi yesekethe ye-FPC eguquguqukayo idla ngokudityaniswa ne-adhesive thermosettingifilimukwayepolyimide stiffeneripleyiti.I-adhesive thermosettingifilimuis ngaphandle viscosity ngelixaiqinile kwiqondo lobushushu eliqhelekileyo, kodwa xa ubushushu bonyuka busiya kwiqondo elithileuluhlu, iya kutshintsha ibe yi-semi-solidified state kunye ne-viscosity eqinile.Ngeli xesha, i-FPC iya kunamathela kwipolyimide stiffeneripleyiti.Inkqubo jikelele kukulungelelanisaI-PI stiffener kufanelekile ekuneneisikhundla, kwaye usebenzise umbanei-solderingiron for 1 ~ 2 imizuzwana ukuyalungisa iindawo enyen.Emva kokushisa okuphezulu kunye noxinzelelo oluphezulunge, wonke umphezuluiza kubayiukudibanisa ngokupheleleyo,ngokoukubhakaifilimu ukunyanga i-adhesive.
Imeko yokusetyenzwa kwefilimu yepolyimide eyenziwe ngobhedu okanye iphepha le-polyimide stiffener:
1. Ibhendi yokuqala: iqondo lobushushu 120℃, uxinzelelo oluphezulu 20kg/ cm², 1min;
2. Ibhendi yesibini: iqondo lobushushu 140℃, uxinzelelo oluphezulu 30kg/ cm², 80min;
3. Ibhendi yesithathu: iqondo lobushushu 80℃, uxinzelelo oluphezulu 30kg/ cm², 5min;
Isicelo:
Indibano yebhodi yeFPC
PCB Board ukwenziwa
I-Coverlay okanye i-Stiffener kwi-F-PCB.
Indibano yebhodi yesekethe yeemoto
ITransformer kunye neMotor Insulation.