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  • Icwecwe leCopper Clad Polyimide yeFilimu eNye icala leFCCL yeNdibano yeBhodi yeFPC

    Inkcazelo emfutshane:

     

    Ifilimu yeCopper Clad Polyimideisebenzisa ifilimu ye-amber okanye emnyama ye-polyimide njengefilimu esisiseko kwaye ifakwe ngeteyiphu yobhedu.Idla ngokusetyenziswa kunye nefilimu egqunyiweyo ye-thermosetting kwishishini lebhodi yeebhodi zeFlexible Printed Circuits, ebonisa ukumelana nobushushu obuphezulu kunye nokusebenza kobushushu.Ubushushu bokumelana ne-solder yi-288℃ ngaphandle kwamaqamu kunye ne-delamination.Sineemveliso ezipheleleyo ze-PI base FCCL kunye ne-polyimide thermosetting coverlay kunye ne-polyimide stiffener sheet, enokubonelela ngezisombululo zobungcali kwindibano yeBhodi ye-FPC okanye okunye ukuxhathisa ubushushu kunye neshishini lokuvelisa ukufakwa kombane.


    Iinkcukacha zeMveliso

    Iithegi zeMveliso

    Iimbonakalo:

    1. Ukumelana kakuhle nokucheba

    2. Ubushushu bokumelana ne-Soldering yi-288℃

    3. Uzinzo olugqwesileyo lweekhemikhali,

    4. Ukumelana nemitha,

    5. Ukumelana ne-Chemical solvent kunye ne-anti-corrosion

    6. Kulula ukufa-ukunqunyulwa kulo naluphi na uyilo lwemilo yesiko

    7. Ukufakwa kombane okumgangatho ophezulu

    8. I-adhesive ye-thermosetting

    9. Ukugqiba okugudileyo, akukho amaqamza kunye nokuncipha

    ifilimu ye-polyimide

    Ibhodi yesekethe ye-FPC eguquguqukayo idla ngokudityaniswa ne-adhesive thermosettingifilimukwayepolyimide stiffeneripleyiti.I-adhesive thermosettingifilimuis ngaphandle viscosity ngelixaiqinile kwiqondo lobushushu eliqhelekileyo, kodwa xa ubushushu bonyuka busiya kwiqondo elithileuluhlu, iya kutshintsha ibe yi-semi-solidified state kunye ne-viscosity eqinile.Ngeli xesha, i-FPC iya kunamathela kwipolyimide stiffeneripleyiti.Inkqubo jikelele kukulungelelanisaI-PI stiffener kufanelekile ekuneneisikhundla, kwaye usebenzise umbanei-solderingiron for 1 ~ 2 imizuzwana ukuyalungisa iindawo enyen.Emva kokushisa okuphezulu kunye noxinzelelo oluphezulunge, wonke umphezuluiza kubayiukudibanisa ngokupheleleyo,ngokoukubhakaifilimu ukunyanga i-adhesive.

    Imeko yokusetyenzwa kwefilimu yepolyimide eyenziwe ngobhedu okanye iphepha le-polyimide stiffener:

    1. Ibhendi yokuqala: iqondo lobushushu 120℃, uxinzelelo oluphezulu 20kg/ cm², 1min;

    2. Ibhendi yesibini: iqondo lobushushu 140℃, uxinzelelo oluphezulu 30kg/ cm², 80min;

    3. Ibhendi yesithathu: iqondo lobushushu 80℃, uxinzelelo oluphezulu 30kg/ cm², 5min;

     

    Isicelo:

    Indibano yebhodi yeFPC

    PCB Board ukwenziwa

    I-Coverlay okanye i-Stiffener kwi-F-PCB.

    Indibano yebhodi yesekethe yeemoto

    ITransformer kunye neMotor Insulation.


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