Vaega:
1. Lelei le faʻafefeteina o sele
2. Soldering tetee vevela e 288 ℃
3. tulaga mautu kemisi lelei,
4. Tete'e fa'avevela,
5. Tete'e solvent vailaau ma anti-corrosion
6. Fa'afaigofie ona oti-oti i so'o se fa'ailoga fa'aleaganu'u
7. Insulation eletise vasega maualuga
8. Fa'apipi'i vevela
9. Smooth i'uga, leai ni bubbles ma delamination
FPC fetuutuunai laupapa matagaluega e masani ona pipii i thermosetting pipiiata tifagamapolyimide faʻamaʻaipu.Le fa'apipi'i thermosettingata tifagais e aunoa ma le viscosity aomalo i le vevela masani, ae a oʻo i luga le vevela i se tulagalautele, o le a suia i se tulaga semi-solidified ma viscosity malosi.I le taimi nei, o le a pipii le FPC i lepolyimide faʻamaʻaipu.O le fa'ata'ita'iga masani o le fa'aoga o lePI malo fetaui i se itu taumatautulaga, ma faaaoga le eletisefa'amauinau'amea mo 1~2 sekone ifaaleleia letulaga tulaga tasin.A maeʻa le maualuga o le vevela ma le lomitusi maualugaing, luga atoao le'afusia atoatoa,onataoinale ata e fofo ai le pipii.
Le tulaga fa'agaioiga o ata polyimide o lo'o fa'aofuina i le 'apamemea po'o le pepa fa'amalo polyimide:
1. O le vaega muamua: vevela 120 ℃, maualuga mamafa 20kg / cm², 1min;
2. O le vaega lona lua: vevela 140 ℃, mamafa maualuga 30kg / cm², 80min;
3. O le vaega lona tolu: vevela 80 ℃, maualuga mamafa 30kg / cm², 5min;
Talosaga:
Fono a le FPC
PCB Board gaosiga
Ufiufi po'o le Fa'amalo i F-PCB.
Fonotaga laupapa matagaluega ta'avale
Transformer ma afi Insulation.
