Mawonekedwe:
1. Kukana kukameta ubweya wabwino
2. Kutentha kwa kutentha kwa kutentha ndi 288 ℃
3. Kukhazikika kwamphamvu kwamankhwala,
4. Kukana kwa radiation,
5. Chemical zosungunulira kukana ndi odana ndi dzimbiri
6. Zosavuta kufa-kudula mumapangidwe amtundu uliwonse
7. Kutsekemera kwamagetsi kwapamwamba
8. Thermosetting zomatira
9. Mapeto osalala, opanda thovu ndi delamination
![filimu ya polyimide](http://www.gbstape.com/uploads/polyimide-film.jpg)
FPC flexible circuit board nthawi zambiri imamangiriridwa ndi zomatira za thermosettingkanemandipolyimide stiffenermbale.Thermosetting zomatirakanemais popanda mamasukidwe akayendedwecholimba pa kutentha kwabwino, koma kutentha kukakwera kufika pamlingo winaosiyanasiyana, izo zidzasintha kukhala theka-okhazikika boma ndi mamasukidwe akayendedwe amphamvu.Panthawiyi, FPC idzamamatira kupolyimide stiffenermbale.Mchitidwe ambiri ndi agwirizane ndiPI stiffener oyenera kumanjaudindo, ndi ntchito magetsisolderingchitsulo kwa 1 ~ 2 masekondi kutikonzasingle point position.Pambuyo pa kutentha kwakukulu ndi kusindikiza kwakukulundi, padziko lonseadzakhalakugwirizana kwathunthu,ndiyekuphikafilimu kuchiritsa zomatira.
Kukonzekera kwa filimu yamkuwa ya polyimide kapena pepala la polyimide stiffener:
1. Gulu loyamba: kutentha 120 ℃, kuthamanga kwambiri 20kg/cm², 1min;
2. Gulu lachiwiri: kutentha 140 ℃, kuthamanga kwambiri 30kg/cm², 80min;
3. Gulu lachitatu: kutentha 80 ℃, kuthamanga kwa 30kg/cm², 5min;
Ntchito:
Chithunzi cha FPC
PCB Board kupanga
Coverlay kapena Stiffener mu F-PCB.
Msonkhano wa komiti yoyendera magalimoto
Transformer ndi Motor Insulation.